The Koch Chemie Micro Cut Pad is a high-quality special sponge suitable for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23 mm creates low torsion forces, very good handling and the highest level of stability.
The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 10
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