Koch Chemie Micro Cut Pad

The Koch Chemie Micro Cut Pad is a high-quality special sponge suitable for removing fine scratches, holograms and polishing marks using the Micro Cut M3.02 and Micro Cut & Finish P3.01. The short height of 23 mm creates low torsion forces, very good handling and the highest level of stability.

The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.

Compression hardness: 10

Abrasiveness: 5

NOTICE

This product information can advise you only without obligation. Liability on our part can not be derived. Please check whether the product is suitable for your application. We will be pleased to assist you.